Photoelastic Modulator
Low-cost and compact optical device for converting standard image sensors into high-resolution depth sensors.
About the Technology
Depth sensors are a key enabler of many applications, ranging from the vastly expanding fields of robotics, drones, augmented reality, virtual reality, machine vision, and surveillance. Existing depth sensors have limited spatial resolution and are expensive due to their reliance on specialized designs/manufacturing.
We propose an entirely new paradigm in designing depth sensors, anchored in the use of standard CMOS image sensors, combined with mass-producible optical components to add the third dimension for sensing. This strategy leverages the extensive investments in the last two decades—over $100 billion—that have established CMOS image sensors as a staple of the industry. By capitalizing on the high-definition capabilities of standard CMOS image sensors, which can reach over 100 megapixels, our system promises a resolution exponentially higher than existing solutions. Crucially, it also offers a viable route towards mass production and ubiquitous deployment.
Team Members
Press
- Stanford engineers enable simple cameras to see in 3D. Stanford News (28 March 2022).
Related Web Links
Publications:
- O. Atalar and A. Arbabian, “Optically isotropic longitudinal piezoelectric resonant photoelastic modulator for wide angle polarization modulation at megahertz frequencies,” JOSA A, December 2023.
- O. Atalar, S. Yee, A.H. Safavi-Naeini, and A. Arbabian, “YZ cut lithium niobate longitudinal piezoelectric resonant photoelastic modulator,” Optics Express, December 2022
- O. Atalar, R. Van Laer, A.H. Safavi-Naeini, and A. Arbabian, "Longitudinal piezoelectric resonant photoelastic modulator for efficient intensity modulation at megahertz frequencies," Nature Communications, March 2022.
- O. Atalar, R. Van Laer, C.J. Sarabalis, A.H. Safavi-Naeini, and A. Arbabian, “Time-of-flight imaging based on resonant photoelastic modulation,” Applied Optics, March 2019.